market shares by exploiting its improved access to Asian markets

In his presentation, Günter Lauber, CEO of the SIPLACE teams, pointed out the rapid success of this integration, for which he credited in part the industry experience of the ASM group, which has for many years been a leader in the backend/chip assembly segment with its solution for waver and chip production. According to Lauber, thanks to the new owner’s decision to keep the led linear high bay light team in place along with its locations and its cluster organization, the company did not have to waste any time with restructurings in the current boom, but could focus on serving the needs of customers and markets. In a second integration phase, the SIPLACE team plans to gain additional market shares by exploiting its improved access to Asian markets, lowering its costs through shared sourcing and expanding its solution spectrum through new R&D initiatives.

In his presentation, Joe Poh, who heads SIPLACE’s operations in China, underscored the central role SIPLACE China plays in implementing the company’s growth strategy. Joe Poh’s team plays a special role as both SIPLACE’s representative on its most important market and as a “bridge“ in the integration of the two companies. “With its German engineering, SIPLACE has been a recognized as the technology leader and the No. 1 on the European market for many years, while ASM Pacific Technology is the world leader in backend solutions thanks to its leading position in Asia. By taking care of our local customers as SIPLACE China, we want to make sure that SIPLACE becomes the world’s leading placement machine maker over the medium term,” said Joe Poh about the importance of the Chinese market and the SIPLACE organization’s role in it. To accomplish this, the company is further improving its direct and competent support for Chinese electronics manufacturers by expanding its network of sales offices, service centers and technology, training and application centers. SIPLACE is also developing new products in close cooperation with customers in China and the rest of Asia.

Herbert Hofmann, China COO of ASM Assembly Systems offered detailed insights into his company’s current developments and innovations. In response to the concrete challenges facing electronics manufacturers in the areas of new product introductions, setup changeovers and volume production, Hofmann presented the latest solutions developed by SIPLACE’s engineers. The spectrum of innovations ranges from NPI solutions such as SIPLACE Smart Pin Support or SIPLACE Alternative Components to high-mix setup concepts such as Random Setup or Constant Table to general efficiency improvements with led high bay light, SIPLACE LED Pairing or SIPLACE Nozzle ID Scanning. Hofmann underscored several times that modern SMT solutions are increasingly based on intelligently intertwined hardware, software and service components and that the SIPLACE team succeeded in making significant progress over its competitors in these fields in recent years.