In addition, manufacturing processes for OLEDs have also progressed significantly. GE and the Fraunhofer Institute have both demonstrated roll-to-roll manufacturing of OLED lighting which will ultimately lead to significant cost improvements in OLED fabrication. Low cost printing approaches and new small molecule inks will also help propel led flood light into the backlighting market. The related expects that the OLED backlighting market will reach $1.1 billion by 2015. And while the first OLED lighting panels are quite small, the recent scaling up of factories in Asia to build large OLED displays will certainly benefit the manufacturing infrastructure for LED lighting and lead to larger panels within a few years.
There is an increasing demand to develop brighter green LEDs for future applications such as back light for high-definition LCD television. Under the agreement, Taiyo Nippon Sanso and IMEC will develop high-efficiency green LED device manufacturing technology based on IMEC's compound semiconductors device technology. Research is mainly carried out at the IMEC facilities in Leuven, Belgium and builds on IMEC's expertise in strain engineering on large wafer diameter, supported by in-situ growth monitoring.
According to Professor Gilbert Declerk, president and CEO of IMEC, the collaboration with Taiyo Nippon Sanso, a total solution provider in the compound semiconductor field including metal organic materials, gas supply system, purification, abatement system and MOCVD tool, enables us to accelerate the development of high efficiency green led high bay light manufacturing technology.This is a unique opportunity to create a transcendent technology that not only enables energy-efficient lighting, but also creates the next generation of secure wireless communications. As we switch from incandescent and compact florescent lighting to LEDs in the coming years, we can simultaneously build a faster and more secure communications infrastructure at a modest cost along with new and unexpected applications.
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